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PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ultimately resulting in board warpage.

This model, based on the PCB to Material Data add-in, simulates the warpage and residual stress of the PCB under the reflow soldering temperature profile.

Note: The material specifications of the viscoelastic material are based on the paper: Jeong-Hyeon Beak, Dong–Woon Park, Gyung-Hwan Oh, Dong–Ok Kawk, Simon S. Park, Hak-Sung Kim, Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package, Materials Science in Semiconductor Processing 148 (2022) 106758