论文和技术资料

In this work, an analysis is presented for a 3-dimensional RF MEMS coil using the COMSOL AC/DC module in conjunction with the CAD import module. The realization of being able to produce such 3-dimensional RF coils allows for less surface area to be needed for similar inductor performance in comparison to larger planar RF coils by maintaining the same number of turns through super-positioning of the connected multi-turn layers. This analysis is verified in its accuracy by performing actual impedance testing.