论文和技术资料

3D electro-thermo-mechanical finite element model of power vertical MOSFET used in the automotive industry is presented in this paper. The presented paper is a qualitative study of power device results from electro-thermo-mechanical simulation. This study particularly interested in the stress generated at the interface between the bonding wires and the source metallization to evaluate the influence of the thickness of aluminum metallization on the stress distribution. Power device model is achieved with COMSOL Multiphysics software using a 3D electro-thermo-mechanical element type. The power component consists of power chip that dissipates heat during its operation, two lead frames that are used to evacuate the heat and eight parallel aluminum bonding wires which connect the aluminum metallization layer to the copper lead frame. The component is geometrically and loads symmetric, so we considered that it is sufficient to model half of the structure to describe the total behavior of the component.