论文和技术资料

Due to the complexity of electromagnetic modeling, researchers and scientists always look for development of accurate and fast methods to extract the parameters of electronic interconnects and package structures. In this paper, we illustrate modeling of multiconductor interconnects in multilayered dielectric media using COMSOL Multiphysics and the finite element method.

We specifically determine the capacitance per unit length of four transmission lines in two-layered dielectric and three thin striplines embedded in a three-layered dielectric between two ground planes. Comparison of our results with other available methods is demonstrated with good agreements.