论文和技术资料

Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D thermo-mechanical model of a soldered pin is achieved in two simulation steps. First, a connecting pin already attached to a fixed circuit board is placed in the via of a secondary circuit board, both are heated to a temperature according to the soldering process, then as a second step, the tin-solder is placed between the pin and secondary circuit board to finally let the system cool down.