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La5Ca9Cu24O41 Layers as 1D Heat Spreaders for Thermal Management Solutions

C. Orfanidou, and J. Giapintzakis
Department of Mechanical and Manufacturing Engineering
University of Cyprus
Nicosia, Cyprus
发布日期 2011

This paper deals with the design of a viable thermal management solution using La5Ca9Cu24O41 layers for heat channeling. The simulations are carried out with the finite element method using COMSOL Multiphysics Heat Transfer Module.

COMSOL 4.2 was used to model and optimize silicon devices. Malfunctioning elements on silicon devices are sometimes converted into hotspots resulting in the increase of their temperature and that of the adjacent elements. The simulations carried out demonstrate a temperature decrease of the adjacent elements when La5Ca9Cu24O41 layers are introduced in such devices.

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