技术资料
白皮书和应用说明
Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors
发布日期 2011
Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.
下载
- bhalla_paper.pdf - 0.37MB