技术资料
白皮书和应用说明
Study of Tertiary Current Distributions on the Wafer in a Plating Cell
发布日期 2012
The reciprocating paddle cell is a known practical method for depositing alloy films on wafer substrates. Recently, the mass transfer boundary layer within an industrial wafer plating cell was studied based on the measurement of limiting current. It was indicated that a shear-plate fluid agitation mechanism is capable of generating a thin (i.e.
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