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Temperature Compensated AIN Based SAW Simulation using COMSOL

Andrew B. Randles[1]
Julius M. Tsai[1]
Piotr Kropelnicki[1]
Hong Cai[1]

[1]Institute of Microelectronics, Agency of Science, Technology, and Research, Singapore, Singapore
发布日期 2013

We have modeled surface acoustic wave (SAW) devices composed of piezoelectric materials: aluminum nitride (AlN), lithium niobate (LiNbO3), and quartz. These materials are often used in RF filters and wireless sensors, which require temperature compensation for stability. Using our COMSOL Multiphysics® simulation with published values of thermal expansion for each material, we simulated the TCF of each structure and observed the effects of the materials and the SiO2 trench shapes on the TCF.

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