论文和技术资料

In a modern IC design, the capability of predicting the temperature profile is critically important as well as cooling and related thermal problems are the principal challenges. To address these challenges, thermal analysis must be embedded within IC synthesis. This paper presents thermal analysis of the FCBGA chip with a 4mm×4mm×0.3mm silicon die. The silicon die dissipates heat flux of different power from 1W to 5W. The aluminium heat sink is provided for convective cooling over the chip. Epoxy glue layer is provided to attach the heat sink with a 4 layer FCBGA substrate. The results are analyzed in COMSOL Multiphysics® software by using the Heat Transfer Module. The heat sink provides the best thermal performance of FCBGA Chip package. The silicon die temperature is less than 325K for 2W power and analyzed temperature profile of the FCBGA heat sink.

Keyword: Heat sink, Comsol Multyphysics®