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在 2024 年 COMSOL 用户年会上，来自全球的科研人员和工程师展示了他们的多物理场仿真成果。欢迎浏览相关技术论文和演示文稿，了解您所在行业的研究人员当前如何利用数值建模优化产品设计、简化工作流程并改进产品性能。

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ISBN: 978-1-7364524-0-0

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2018 - All

Development of a Mathematical Model for an Anode Baking Process with COMSOL Multiphysics®

P. Nakate [1], D. Lahaye [1], C. Vuik [1], M. Talice [2],
[1] Delft University of Technology, Netherlands
[2] PM2 Engineering, Italy

The anode baking process has gained significant attention since the 1980s due to its importance in Aluminium ... 扩展阅读

Detailed Axial Symmetrical Model of Large-Scale Underground Thermal Energy Storage

A. Dahash [1], M. B. Janetti [1], F. Ochs [1],
[1] Unit of Energy-Efficient Buildings, Institute of Structural Engineering and Material Science, University of Innsbruck, Innsbruck, Austria

Seasonal thermal energy storage (STES) systems are key components for expanding the renewables share in the ... 扩展阅读

Simulation of Laser-Excited Surface Acoustic Waves Travelling on a Steel Hemisphere Shell

J. Mäkinen [1], D. Veira Canle [1], R. Blomqvist [1], A. Salmi [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that ... 扩展阅读

Numerical Approaches to Modeling of WGM Resonator and Waveguide Coupling

N. M. Kondratiev [1],
[1] Russian Quantum Center (RQC), Skolkovo, Moscow, Russia

Whispering-gallery mode resonators (WGR) are promising elements for future photonic devices, as they combine ... 扩展阅读

The Numerical Challenges in Multiphysical Modeling of Laser Welding with ALE

I. Tomashchuk [1], I. Bendaoud [2], J.-M. Jouvard [1], P. Sallamand [1],
[1] Laboratoire Interdisciplinaire Carnot de Bourgogne, Université de Bourgogne-Franche-Comté, Le Creusot, France
[2] Laboratoire de Mécanique et Génie Civil, Université de Montpellier, France

The interaction of high power laser beam with metallic materials produces a number of interconnected ... 扩展阅读

J-Integral Evaluation for Through Silicon Vias

R. Coppeta [1], C. Hartler [2], J. Siegert [1],
[1] ams AG, Premstaetten, Austria
[2] Technische Universitaet Graz, Graz, Austria

Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical ... 扩展阅读

Hot Cracking in Nb-Si Alloys

I. Y. Fernando [1],
[1] University of Leicester, Leicester, UK

Introduction With the vast development in the aerospace industry it is inevitable that currently used ... 扩展阅读

Multiscale and Multiphysics Modeling of an Adaptive Material for Sound Absorption

T. G. Zielinski [1], K. C. Opiela [1],
[1] Institute of Fundamental Technological Research of the Polish Academy of Sciences, Warsaw, Poland

A concept of an adaptive sound absorbing material is proposed and investigated numerically using the COMSOL ... 扩展阅读

Structural Mechanics, Acoustics Module - Numerical Study of Loudspeaker Diaphragm Geometry

A. Mageswaran [1],
[1] DTU-Technical University of Denmark, Denmark

The study of loudspeaker diaphragm geometry is aimed to focus on how does the distribution of mass in the ... 扩展阅读

Simulation of 1D Heat Distribution in Heavy Oil Reservoirs During Steam Injection Process

T. H. Nassan [1],
[1] Freiberg University of Technology, Institute of Drilling Technology and Fluid Mining Engineering, Freiberg, Germany

Enhanced oil recovery (EOR) is expanding worldwide to produce more oil from the existing reservoirs to fulfil ... 扩展阅读

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