论文和技术资料

G. Eriksson[1]
[1]ABB, Corporate Research, Västerås, Sweden

N.S. Lawand[1], J. van Driel[2], P.J. French[2]
[1]Electronic Instrumentation Laboratory (EILab), Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), Delft University of Technology, Delft, The Netherlands
[2]Delft University of Technology, Delft, The Netherlands

Y.A. Urzhumov[1][,][2], N.I. Landy[1][,][2], C. Ciraci[2], D.R. Smith[1][,][2]
[1]Department of Electrical and Computer Engineering, Pratt School of Engineering, Duke University, Durham, NC, USA
[2]Center for Metamaterials and Integrated Plasmonics, Pratt School of Engineering, Duke University, Durham, NC, USA

N. Badi[1], R. Mekala[2]
[1]Department of Physics, Center for Advanced Materials, University of Houston, Houston, TX, USA
[2]Department of Electrical & Computer Engineering, University of Houston, Houston, TX, USA

I.M. Abdel-Motaleb[1], K. Allen [1]
[1]Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA

P. Keutelian[1], A. Krishnamurthy[1], G. Chen[1], B. Ulmen[1], G.H. Miley[1]
[1]University of Illinois at Urbana-Champaign, Champaign, IL, USA

I. Terechkine[1], T. Khabiboulline[1], D. Sergatskov[1]
[1]Fermi National Accelerator Laboratory, Batavia, IL, USA

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

E.M. Glenn[1]
[1]University of California, Irvine, CA, USA

J. Leman[1]
[1]POWER Engineers, Hailey, ID, USA