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Thermomechanical Properties of Elastomeric Stamps for Micro-Transfer Printing Applications

C. Reyes¹, K. Oswalt ¹, J. Thostenson¹, J. Roe¹, D. Gomez¹
¹X-Celeprint, Durham, NC, USA

Micro-transfer printing (MTP) enables mass-transfer of wafer-level chips having lateral dimensions ranging ... 扩展阅读

Assessing the risk of cracking for wooden sculptures due to dynamic relative humidity changes

M. Sobon¹, L. Bratasz¹
¹Jerzy Haber Institute of Catalysis and Surface Chemistry, Poland

Wooden sculptures are an important part of European cultural heritage, but they are also among the most ... 扩展阅读

Fluid Structure Interaction of Arch Dam on Full Reservoir Level under Seismic Loading

R. Manikandan[1], R. Jayashiri [1], R. Indumathi [1], J. Archana [1],
[1] Dhirajlal Gandhi College of Technology, Salem, Tamil Nadu, India

The Finite Element Model is analyzed with impounded water considering appropriate boundary conditions between ... 扩展阅读

Multiphysics Modeling of High Power Magnetron

A. Jadhav[1], K. Tuckley[1], H. Dixit[2], J. John[1]
[1]IIT Bombay, India
[2]BITS Pilani, Hyderabad Campus, India

The magnetron is one of the oldest and the most popular of the vacuum tubes. As they are very robust, low ... 扩展阅读

Design and Simulation of a MEMS-Based Ultrasonic Transducer for Viscosity Sensing Applications

Rahul Goyal [1], Divya Mohan Yadav [1],
[1] Indian Institute of Science, Bangalore, Karnataka, India

Technologies based on micro electro mechanical systems (MEMS) present advantages for rheological applications ... 扩展阅读

Periodic 3D Leaky SAW Simulations with 42 Y-cut Lithium Tantalate

S. Yandrapalli [1], V. Plessky [1],
[1] GVR Trade SA, Gorgier, Neuchatel, Switzerland

Introduction Leaky Surface Acoustic Wave (LSAW) resonators in rotated Y-X cut Lithium Tantalate (LiTaO3) are ... 扩展阅读

Electrothermal Study of Cu-CNT Composite TSV Using COMSOL Multiphysics®

K. Sable[1], B. Kumari[2], M. Sahoo[3]
[1]M.Tech Scholar, Indian Institute of Technology Dhanbad., India
[2]SRF, Indian Institute of Technology Dhanbad., India
[3]Assistant Professor, Indian Institute of Technology Dhanbad., India

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to ... 扩展阅读

Tribological Behavior of Rubber on Glass in Prefilled Syringes

T. Langley [1], E. Gutierrez-Miravete [2], ,
[1] Rensselaer Polytechnic Institute, Troy, NY, USA
[2] Rensselaer at Hartford, Hartford, CT, USA

The primary enclosure of an injected formulation is almost exclusively comprised of a glass container ... 扩展阅读

Modeling Cracking in Quasi-Brittle Materials Using Isotropic Damage Mechanics

T. Gasch [1], A. Ansell [1],
[1] KTH Royal Institute of Technology, Stockholm, Sweden

An extension of the Solid Mechanics interface in COMSOL Multiphysics® is presented to analyze localized ... 扩展阅读

Analysis of Static Stress in a Bicycle Chain Plate

M. Wagner [1], T. Koch [2], I. Kühne [3], A. Frey [1]
[1] Augsburg University of Applied Sciences, Augsburg, Germany
[2] Comsol Multiphysics GmbH, Göttingen, Germany
[3] Heilbronn University, Kuenzelsau, Germany

Using the Solid Mechanics interface, a model is set up to investigate the impact of static stress on a ... 扩展阅读

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