论文和技术资料

M. Harb [1], R. Malaeb [1], E. Mahfoud [1],
[1] Department of Mechanical Engineering, American University of Beirut, Libanon

O. Tommiska [1], J. Mäkinen [1], J. Hyvönen [1], A. Meriläinen [1], A. Salmi [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

J. Mäkinen [1], D. Veira Canle [1], T. Ylitalo [1], R. Montonen [1], H. Malinen [1], S. Bäckroos [1], P. Ihalainen [1], E. Lampsijärvi [1], J. Heikkilä [1], T. Paulin [1], A. Salmi [1], A. Kontiola [1], I. Kassamakov [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

M. Wagner [1], T. Koch [2], I. Kühne [3], A. Frey [1]
[1] Augsburg University of Applied Sciences, Augsburg, Germany
[2] Comsol Multiphysics GmbH, Göttingen, Germany
[3] Heilbronn University, Kuenzelsau, Germany

M. Fandaros¹, E. Steadman¹, W. Yin¹, YY. Li², JJ. Cao^2
1Department of Biomedical Engineering, Stony Brook University, Stony Brook, NY, USA
²Cardiac Imaging, DeMatteis Center for Cardiac Research and Education, St. Francis Hospital, Roslyn, New York, United States

Nsidibe-Obong E. Moses¹, Francis Franklin¹, Vladimir Zivkovic¹, Katarina Novakovic ^1
1School of Engineering, Newcastle University, Newcastle upon Tyne, UK

Zain Mansoor¹, Claudia Allegranza^1
1ESA/ESTEC, Keplerlaan 1, 2200 AG, Noordwijk, Netherlands

K. Das [1], N. Mishra [1],
[1] Indian Institute of Technology Bhubaneswar, Bhubaneswar, Odisha, India.

Beatrice Carasi¹, Lucrezia Guarino¹, Lucia Zullino¹, Luca Cecchetto^1
1STMicroelectronics

沈磊 [1], 丁晓红 [2],
[1] 上海理工大学、上海市
[2] 上海理工大学