论文和技术资料

D. Pugal[1], K. Kim[1], and A. Aabloo[2]
[1]ME Department, University of Nevada Reno, Reno, NV
[2]University of Tartu, Tartu, Estonia

L. Lam, and R. Darling
University of Washington
Seattle, WA

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

A. Warning, A. K. Datta, A. Dhall, and D. Mitrea
Department of Biological and Environmental Engineering
Cornell University
Ithaca, NY

G. H. Miley[1], M. P. Reilly[2], B. Ulmen[3], P. Keutelian[3], and J. Orcutt[3]
[1]NPL Associates, Inc., Urbana-Champaign, IL
[2]Starfire Industries, Champaign, IL
[3]University of Illinois, Urbana-Champaign, IL

M. Gobbert, M. Whitmore, B. Peercy, M. Baker, and D. Trott
University of Maryland Baltimore County
Baltimore, MD

D. Gonzalez[1], J. Gardner[1], and O. Tigli[2]
[1]Biomedical Engineering, University of Miami, Coral Gables, FL,
[2]Electrical and Computer Engineering, University of Miami, Coral Gables, FL

L. Desgrosseilliers, and D. Groulx
Mechanical Engineering
Dalhousie University
Halifax, NS
Canada

C. Liu, and D. Groulx
Mechanical Engineering
Dalhousie University
Halifax, NS
Canada

E. Evgin, J. Infante Sedano, and Z. Fu
University of Ottawa
Ottawa, ON
Canada