论文和技术资料

A.Weddemann[1], D. Kappe[2], and A. Hütten[2]
[1]Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge MA, USA
[2]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

B. Granula[1], K. Porzig[2], H. Toepfer[2], M. Gacanovic[1]
[1]University of Banja Luka, Banja Luka, Bosnia-Herzegovina
[2]Technische Universität Ilmenau, Ilmenau, Germany

G. Zhang[1], Y. Zhao[1]
[1]Clemson University, Clemson, SC, USA

C. Rémi, M. Bergeron, and S. Moreau
Cemagref
Antony, France

T. D. Bui[1], F. Bremerkamp[2], and M. Nowottnick[2]
[1]Department of Automobile Engineering, Thanh Do University, Ha Noi, Vietnam
[2]Institute of Electronic Appliances and Circuits, Department “Reliability and Safety of Electronic Systems”, University of Rostock, Rostock, Germany

U. Hafner [1],
[1] Baumer Electric AG, Frauenfeld, Switzerland

A.H. Hegab[1], J.P. Kaerst[1]
[1]HAWK, University of Applied Sciences and Arts, Goettingen, Germany

M. Rivero[1], O. Andreev[2], A. Thess[3], S. Cuevas[4], T. Fröhlich[1]
[1]Institute of Process Measurement and Sensor Technology, Ilmenau University of Technology, Ilmenau, Germany
[2]Helmholtz-Zentrum Dresden-Rossendorf e. V., Institut für Sicherheitsforschung Abteilung Magnetohydrodynamik, Dresden, Germany
[3]Institute of Thermodynamics and Fluid Mechanics, Ilmenau University of Technology, Ilmenau, Germany
[4]Instituto de Energías Renovables, Universidad Nacional Autónoma de México, Temixco, Morelos, México

J. Golebiowski[1], S. Milcarz[1]
[1] Department of Semiconductor and Optoelectronics Devices, Technical University of Lodz, Lodz, Poland

朱铧丞 [1], 张春 [1], 叶菁华 [1],
[1] 四川大学，成都，四川，中国