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"solid mechanics"

Numerical Optimization of the Ultrasonic Cleaning Technique for Pipelines

H. Lais[1], J. Kanfoud[1], T. Gan[2]
[1]Brunel Innovation Centre, United Kingdom
[2]TWI Ltd., United Kingdom

Fouling accumulation in pipelines is a known problem in industry which is currently treated by mechanical, ... 扩展阅读

Effect of particle shape in the Young moduli of SiC particle reinforced Al matrix composite

Luisa Carmen Villacorta Hernández¹, Jorge Enrique Rivera Salinas², Lucero Rosales Marines¹, Karla M. Gregorio Jáuregui³, Alejandro Cruz Ramírez³
¹Chemical Science and Technology Postgraduate, Chemical Science Faculty. Autonomous University of Coahuila, Saltillo, Coahuila, Mexico.
²Department of Plastics Transformation Processing, Centro de Investigación en Química Aplicada—CIQA, Saltillo, Coahuila, Mexico.
³Metallurgy and Materials Department, Instituto Politécnico Nacional, Escuela Superior de Ingeniería Química e Industrias Extractivas—ESIQIE, UPALM, México D.F., Mexico.

Particulate reinfoced metal matrix composites (PRMMC) show good combination of strength-to-weight ratio, as a ... 扩展阅读

Lagrangian Free Subduction Model Based on Viscoelastic Material using COMSOL Multiphysics®

J. Keum[1], B. So[1]
[1]Kangwon National University, Korea, Republic of

Subduction, the process through which the cold and dense oceanic lithosphere sinks into the highly viscous ... 扩展阅读

Actuation Force Study of Next Generation Micro Shutter Array for More Reliable Actuation

K. Kim[1], M. Li[2], A. Kutyrev[3], M. Greenhouse[2]
[1]NASA Goddard Space Flight Center/Science Systems and Applications Inc., USA
[2]NASA Goddard Space Flight Center, USA
[3]NASA Goddard Space Flight Center/University of Maryland College Park, USA

Micro shutter array (MSA) is a programmable optical spatial filtering device fabricated by micro electro ... 扩展阅读

Thermomechanical Properties of Elastomeric Stamps for Micro-Transfer Printing Applications

C. Reyes¹, K. Oswalt ¹, J. Thostenson¹, J. Roe¹, D. Gomez¹
¹X-Celeprint, Durham, NC, USA

Micro-transfer printing (MTP) enables mass-transfer of wafer-level chips having lateral dimensions ranging ... 扩展阅读

Assessing the risk of cracking for wooden sculptures due to dynamic relative humidity changes

M. Sobon¹, L. Bratasz¹
¹Jerzy Haber Institute of Catalysis and Surface Chemistry, Poland

Wooden sculptures are an important part of European cultural heritage, but they are also among the most ... 扩展阅读

Multiphysics Modeling of High Power Magnetron

A. Jadhav[1], K. Tuckley[1], H. Dixit[2], J. John[1]
[1]IIT Bombay, India
[2]BITS Pilani, Hyderabad Campus, India

The magnetron is one of the oldest and the most popular of the vacuum tubes. As they are very robust, low ... 扩展阅读

Fluid Structure Interaction of Arch Dam on Full Reservoir Level under Seismic Loading

R. Manikandan[1], R. Jayashiri [1], R. Indumathi [1], J. Archana [1],
[1] Dhirajlal Gandhi College of Technology, Salem, Tamil Nadu, India

The Finite Element Model is analyzed with impounded water considering appropriate boundary conditions between ... 扩展阅读

Design and Simulation of a MEMS-Based Ultrasonic Transducer for Viscosity Sensing Applications

Rahul Goyal [1], Divya Mohan Yadav [1],
[1] Indian Institute of Science, Bangalore, Karnataka, India

Technologies based on micro electro mechanical systems (MEMS) present advantages for rheological applications ... 扩展阅读

Electrothermal Study of Cu-CNT Composite TSV Using COMSOL Multiphysics®

K. Sable[1], B. Kumari[2], M. Sahoo[3]
[1]M.Tech Scholar, Indian Institute of Technology Dhanbad., India
[2]SRF, Indian Institute of Technology Dhanbad., India
[3]Assistant Professor, Indian Institute of Technology Dhanbad., India

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to ... 扩展阅读

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