论文和技术资料

快速搜索

技术资料

白皮书和应用说明

了解多物理场仿真在基础研究和产品设计中的应用

各个行业的工程师和科研人员都在使用多物理场仿真来研发创新的产品设计和流程。他们在 COMSOL 用户年会上展示了丰富的技术论文和演示文稿，您可以从他们的研究成果中寻找灵感。

使用左侧【快速搜索】工具查找您感兴趣的研究，或按照应用领域进行筛选。

查看 COMSOL 用户年会 2024 论文

All

Boston 2024

Florence 2024

搜索：

Structural Mechanics and Thermal Stresses

Homogenization of Fiber Composite Material Properties: An Adaptive Multiphysics Implementation

J. Stolz [1], P. Fideu [2], A. Herrmann [1],
[1] Faserinstitut Bremen e.V., Bremen, Germany
[2] Airbus Operations GmbH, Hamburg, Germany

Fiber-reinforced composite materials are widely used for building lightweight parts in several application ... 扩展阅读

Improving the Performance of Instant-Fit Earpieces by Making Use of FE-Analyses

D. Stauske [1], S. Kahms [1],
[1] Institute of Dynamics and Vibration Research, Hannover, Lower Saxony, Germany

According to a report conducted by the World Health Organization (WHO), more than 466 million people suffer ... 扩展阅读

Simulation of Lattice Structures in Orthopedic Corsets

W. Rieder [1],
[1] Switzerland Innovation Park Biel-Bienne, Switzerland

Digitization is affecting more and more industrial sectors. In the field of orthopedic technology, new ... 扩展阅读

Simulation of Laser-Excited Surface Acoustic Waves Travelling on a Steel Hemisphere Shell

J. Mäkinen [1], D. Veira Canle [1], R. Blomqvist [1], A. Salmi [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that ... 扩展阅读

J-Integral Evaluation for Through Silicon Vias

R. Coppeta [1], C. Hartler [2], J. Siegert [1],
[1] ams AG, Premstaetten, Austria
[2] Technische Universitaet Graz, Graz, Austria

Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical ... 扩展阅读

Hot Cracking in Nb-Si Alloys

I. Y. Fernando [1],
[1] University of Leicester, Leicester, UK

Introduction With the vast development in the aerospace industry it is inevitable that currently used ... 扩展阅读

Computational Biophysics in COMSOL®: FSI-Simulations of Cells in a Microfluidic Device

L. D. Wittwer [1], S. Aland [2],
[1] HTW Dresden / TU Dresden, Germany
[2] HTW Dresden, Germany

INTRODUCTION The mechanical properties of biological cells are promising biomarkers to differentiate for ... 扩展阅读

Eigenfrequency-App for University Laboratory Education

A. Frey [1], R. Grossmann [1], T. Koch [2], I. Kuehne [3],
[1] University of Applied Science, Faculty of Electrical Engineering, Augsburg, Germany
[2] COMSOL Multiphysics GmbH, Goettingen, Germany
[3] Heilbronn University of Applied Science, Kuenzelsau, Germany

Laboratories are essential parts of the engineering education at Universities of Applied Science. Students ... 扩展阅读

Magneto-Mechanical-Thermal Couplings for the Pulsed Magnetic Technology with Single-Turn Coils

O. Maloberti [1], P. Sansen [1], D. Jouaffre [2], D. Haye [2],
[1] ESIEE Amiens, France
[2] PFT Innovaltech, France

Single turn coils produce AC and transient magnetic fields in pulsed magnetic technologies for which magneto ... 扩展阅读

Empirical Verification of COMSOL® - Simulation of Resonance Frequency of an Archimedean Spiral Coil

M. P. Adams [1], K. P. Koch [1],
[1] Hochschule Trier, Trier, Rhineland Palatinate, Germany

An simple analytical model for the calculation of the resonance frequency of coils typical consists of a ... 扩展阅读

第一页

171–180 of 646

最后一页