快速搜索

电子设备中的冷凝

Application ID: 14397


本案例模拟电子设备盒中湿空气的热动力学演化,目的是分析当外界环境属性发生变化时是否会出现冷凝。模型导入测试的空气温度、压力和水蒸汽浓度等数据,在盒中的水蒸汽浓度并不均匀,因此需要考虑水蒸汽的传递和扩散。

This model is included as an example in the following products:

传热模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.