快速搜索

微连接泵的二维电镀模型

Application ID: 11682


本模型模拟微连接泵的电镀。电镀过程限于质量传递,研究了流速变化对电极电流密度分布的影响。

This model is included as an example in the following products:

电镀模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.