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硅晶片激光加热

Application ID: 13835


一个硅晶片通过一束激光绕着圆轨迹加热,其中晶片在工作台上自转。将激光入射热通量作为在晶片表面分布的热源来处理,得到了晶片的瞬态热响应。计算了加热过程中的温度的峰值、平均值和最小值,以及晶片中的温度分布。

This model is included as an example in the following products:

COMSOL Multiphysics®

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