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薄壳传导

Application ID: 478


本案例分析薄壳结构的热传导现象,并与 NAFEMS 标准解进行比较。

This model is included as an example in the following products:

传热模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.