论文和技术资料

R. Westafer [1], S. Mohammadi [1], A. Adibi [1], W. Hunt [1]
[1] School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

A. Kildishev[1], E. E. Narimanov[1]
[1]Birck Nanotechnology Center, School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana, USA

X. Ni[1,2], Z. Liu[1,2], and A.V. Kildishev[1,2]
[1]School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana, USA
[2]Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana, USA

J. Mauzeroll[1], M. Mayoral[1], and D. Fabre[1]
[1]Department of Chemistry, Université du Québec à Montréal, Montreal, Quebec, Canada

N. Srivastava[1], and C.D. Meinhart[1]
[1]Department of Mechanical Engineering, University of California Santa Barbara, Santa Barbara California, USA

A. Dhall[1], G. Peng[2], G. Squier[2], M. Geremew[3], L. Bogaczyk[2], J. George[3], W.A. Wood[3], and A.K. Datta[1]
[1]Biological and Environmental Engineering, Cornell University, Ithaca, New York, USA
[2]Manufacturing Technology & Engineering, Corning Inc., Sullivan Park, Corning, New York, USA
[3]Corporate Research, Corning Inc., Sullivan Park, Corning, New York, USA

A. Jeremic[1], T. Farncombe[2], S. Liu[2], and Y. Abdul-Rehman[1]
[1]Department of Electrical and Computer Engineering, McMaster University, Hamilton, Ontario, Canada
[2]Department of Radiology, McMaster University, Hamilton, Ontario, Canada

Minhee Jun[1], and Jason V. Clark[1]
[1]Departments of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA

E. R. Blatchley[1], and B.Z. Sun[1]
[1]Department of Civil Engineering, Purdue University, West Lafayette, IN, USA

P. Lee-Sullivan[1], and M. Haghighi-Yazdi[1]
[1]Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario, Canada