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在 2025 年 COMSOL 用户年会上，来自全球的科研人员和工程师展示了他们的多物理场仿真成果。欢迎浏览相关技术论文和演示文稿，了解您所在行业的研究人员当前如何利用数值建模优化产品设计、简化工作流程并改进产品性能。

使用左侧【快速搜索】工具查找您感兴趣的研究，或按照应用领域进行筛选。

ISBN: 978-1-7364524-0-0

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2020 - All

Challenges of DC insulating systems for airborne applications

Dimosthenis Anagnostou¹, Caroline Willich¹, Josef Kallo¹
¹Ulm University, Institute for Energy Conversion and Storage, Ulm, Germany

The era of electrical transportation is here and this includes the aviation sector. However, the ... 扩展阅读

An alternative equation-based model in COMSOL Multiphysics® for bentonite re-saturation

Michael Kröhn¹, Lars Fromme²
¹GRS gGmbH, Brunswick, Lower Saxony, Germany
²Bielefeld University of Applied Sciences, Faculty of Engineering and Mathematics, Bielefeld, Germany

Bentonite is a versatile material that is, among other things, envisaged in designs for radioactive waste ... 扩展阅读

Injection molding simulation: aspects related to the crystallization behavior and micro-morphology

Sara Liparoti¹, Vito Speranza¹, Francesco Marra¹
¹University of Salerne, Dept of Industrial Engineering, Italy

Injection molding is one of the most diffused processes for mass production of polymeric components. It is ... 扩展阅读

Three-dimensional time resolved fluid mechanics simulation of an EWOD-driven micropump

Sebastian Bohm¹, Erich Runge¹
¹TU Ilmenau, Theoretical Physics 1, Germany

This work reports how an EWOD-driven micropump is simulated using COMSOL Multiphysics®. Electrowetting-on ... 扩展阅读

Numerical Modelling of the Membrane Polarization Effect for Realistic Shapes of the Pore Space

N. Resay¹, A. Hördt¹
¹Technische Universität Braunschweig, IGEP, Braunschweig, Germany

The Spectral Induced Polarization (SIP) is a promising electrical method, which can be used to predict the ... 扩展阅读

Modelling of Electric Field Distribution in a Non-thermal Plasma Reactor using COMSOL Multiphysics®

Mina Mortazavi¹, L. Amato¹, N. Manivannan², W. Balachandran¹
¹Electronics and computer engineering, Brunel University London, United Kingdom
²Design Department, Brunel University London, United Kingdom

The state of the art technology is moving towards more complex and multidisciplinary processes and systems. ... 扩展阅读

Thermal study of wafer cooling and heat resistance fitting

Hervé ROUCH¹, Fabrice BOILOT¹
¹INOPRO IAO, Villard De Lans, France

Temperature management and homogeneity on wafers has always an important effect on production in all ... 扩展阅读

Fluid modeling of dielectric barrier discharges for plasma technology

A. P. Jovanović¹, M. Stankov¹, D. Loffhagen¹, M. M. Becker¹
¹INP Greifswald, Germany

COMSOL Multiphysics® with LiveLink™ for Matlab® is used for the numerical analysis of dielectric barrier ... 扩展阅读

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