论文和技术资料

S. Park, S. Chung, and J. Yeow

University of Waterloo, Systems Design Engineering, Waterloo, Ontario, Canada

B. Finlayson, A. Aditya, V. Brasher, L. Dahl, H. Dinh, A. Field, J. Flynn, C. Jenssen, D. Kress, F. Ninh, A. Nordmeier, H. Song, and C. Yuen

University of Washington, Seattle, WA, USA

S. Ryu[1], and P. Matsudaira[2]
[1]Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
[2]Department of Biology and Bioengineering, Massachusetts Institute of Technology, Cambridge, MA, USA

G. Soni[1], T. Squires[2], and C. Meinhart[1]

[1]Department of Mechanical Engineering, University of California Santa Barbara, CA, USA
[2] Department of Chemical Engineering, University of California Santa Barbara, CA, USA

M. Williams, J. Zito, J. Agashe, A. Sopeju, and D. Arnold
University of Florida, Gainesville, USA

A. Auge, F. Wittbracht, A. Weddemann, and A. Hütten
Department of Physics, University of Bielefeld, Germany

O. Myers [1], M. Anjanappa [2], and C. Freidhoff [3]

[1] Mississippi State University, Mississippi State, MS, USA
[2] University of Maryland Baltimore County, Baltimore, MD, USA
[3] Northrop Grumman Corporation, Electronics Systems Sector, Baltimore, MD, USA

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

T. Klose[1], H. Conrad[2], T. Sandner[1], and H. Schenk[1]

[1]Fraunhofer Institute Photonic Microsystems (FhG-IPMS), Germany
[2]TU Dresden, Semiconductor and Microsystems Technology Laboratory, Germany

B. Ottosson[1], Y. Jouahri[2], C. Rusu[1], and P. Enoksson[2]
[1]Imego AB, Gothenburg, Sweden
[2]Chalmers University of Technology, Gothenburg, Sweden