Die-to-Wafer (D2W) Direct Bonding Involving a Dust Particle
Application ID: 152051
In direct bonding, particulate contamination at the interface can significantly reduce bonding quality. Even micron-scale particles may prevent local contact and lead to large interfacial voids.
This model demonstrates a 3D simulation workflow for die-to-wafer (D2W) direct bonding. The simulation accounts for the initial warpage of both the die and wafer and evaluates how a small interfacial particle affects contact evolution and the propagation of the bonding wave.
案例中展示的此类问题通常可通过以下产品建模:
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