Die-to-Wafer (D2W) Direct Bonding Involving a Dust Particle
Application ID: 152051
In direct bonding, if the interface is not clean and particles are present, even particles on the micron scale can significantly degrade the bonding quality, resulting in large-area voids. This model demonstrates the simulation process of 3D D2W direct bonding, taking into account the initial warpage of the die and the wafer, as well as the influence of tiny particles on the propagation of the bonding wave.
案例中展示的此类问题通常可通过以下产品建模:
您可能需要以下相关模块才能创建并运行这个模型，包括：
建模所需的 COMSOL® 产品组合取决于多种因素，包括边界条件、材料属性、物理场接口及零件库，等等。不同模块可能具有相同的特定功能，详情可以查阅技术规格表，推荐您通过免费的试用许可证来确定满足您的建模需求的正确产品组合。如有任何疑问，欢迎咨询 COMSOL 销售和技术支持团队，我们会为您提供满意的答复。
