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MEMS 设备中的热膨胀

Application ID: 1870


本模型分析了微机电设备中的热膨胀效应,例如在微型陀螺仪中,要求热膨胀的影响应尽可能的小。模型中使用了来自于材料库的随温度变化的材料属性。\n\n需要材料库。

This model is included as an example in the following products:

MEMS 模块 结构力学模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.