COMSOL Multiphysics^® 6.4 发布亮点

For users of the AC/DC Module, COMSOL Multiphysics^® version 6.4 introduces transient inductive boundary conditions, symmetry support for terminals, and usability improvements. Read about these updates and more below.

Transient Inductive Boundary Conditions

The Impedance Boundary Condition and the Transition Boundary Condition in the Magnetic Fields interface now support time-domain modeling. This update makes it possible to model thin conductive layers, plates (shielding), or coatings in the time domain without having to resolve the skin effect in the material using a volumetric mesh. The updated boundary conditions are also useful for modeling bulk metals with minimal field penetration, as the interior of the material (typically a metal) does not need to be included in the mode; instead, the modeling domain is simply truncated at the material boundary, and one of these boundary conditions can be used to model the skin effect. This functionality can be viewed in the Thin Conductive Layer Using the Transition Boundary Condition tutorial model.

The Impedance Boundary Condition is used together with a transient study to model the inrush currents and mechanical vibrations in a 3D transformer model featuring a nonlinear magnetostrictive core, frame, and casing.

Symmetry for Terminals

The Terminal feature now supports an area multiplication factor (available in the Advanced Settings section after enabling Advanced Physics Options). This accounts for symmetry by scaling the terminal area so connected circuits or loads will perceive the full device even when only part is modeled. For example, a factor of 2 should be used if the model represents half the device. The update is available for the Electrostatics interface, the Electric Currents interface, and the Magnetic and Electric Fields interface.

A terminal sweep over the electrode array of a touchscreen. The colors indicate the electric field distribution when a single electrode is being activated. The extracted capacitance matrix reflects the position of the stylus on the screen.

Redesigned Context Menus

The feature context menus and toolbars (or ribbons) in all AC/DC interfaces have been redesigned for improved clarity and efficiency. Features are now grouped by type and usage frequency — more commonly used features such as Current Conservation in Solids appear at the top, while less frequently used features are placed in subcategories. Similar features across interfaces are organized consistently, with some renamed for clarity, streamlining the workflow for both simple and advanced models.

The COMSOL Desktop^® environment showing the redesigned feature context menu of the Electric Currents interface. The plot on the right displays the electric current density distribution in an insulated-gate bipolar transistor (IGBT) module.

Magnetomechanics Using Shells and Membranes

To facilitate the modeling of magnetomechanics in shells and membranes, four new physics interfaces are available:

• Magnetomechanics, Shell
• Magnetomechanics, No Currents, Shell
• Magnetomechanics, Membrane
• Magnetomechanics, No Currents, Membrane

Additionally, the new Magnetomechanics, Boundary multiphysics coupling node enables coupling of the Shell and Membrane interfaces to the Magnetic Fields and Magnetic Fields, No Currents interfaces. View these additions in the Nonlinear Ferromagnetic Diaphragm tutorial model. Note that this functionality requires the Structural Mechanics Module.

A magnetic diaphragm that is pulled in by an electromagnet. The deformation, as well as the magnetic field around the coil, is shown.

New and Updated Tutorial Models and App

COMSOL Multiphysics^® version 6.4 brings several new and updated tutorial models, along with an updated app, to the AC/DC Module.

Thermal Analysis of a High-Power IGBT Module

This industrial-scale model investigates the electrothermal behavior of a 1200-V, 1800-A IGBT module in the "on" state. An effective conductivity is used for the semiconductor’s temperature-dependent behavior.

Application Library Title:
igbt_joule_heating
Download from the Application Gallery

Induction Heating Including Curie Temperature and Movement

Induction heating is used in metallurgical processes such as hardening, melting, and brazing. Here, a mechanical joint passing through an induction heating coil is simulated, including Curie point effects and temperature-dependent resistivity.

Application Library Titles:
induction_heating_curie_movement_1khz
induction_heating_curie_movement_25khz
Download from the Application Gallery

Nonlinear Ferromagnetic Diaphragm*

A magnetic diaphragm is a flexible structure that deforms under magnetic fields due to magnetomechanical effects. This model uses the Magnetomechanics, Shell interface to simulate coupled deformation and magnetic field interaction in thin structures.

Application Library Title:
magnetic_diaphragm
Download from the Application Gallery

*Requires the Structural Mechanics Module

Thin Conductive Layer Using the Transition Boundary Condition

The Transition Boundary Condition and Impedance Boundary Condition are used to approximate thin conductive layers, shells, or membranes efficiently. This example validates the Transition Boundary Condition for time- and frequency-domain analysis.

Application Library Title:
thin_conductive\layer
Download from the Application Gallery

Cell Membrane Electroporation

This model shows the electroporation of a cell by means of an electric pulse (as used for pharmaceuticals). The model uses multipole Debye dispersive material data in the time and frequency domains. Results are compared with literature.

Application Library Title:
cell_membrane_electroporation
Download from the Application Gallery

B–H Curve Checker

The updated B–H Curve Checker app, which can be used to verify and optimize B–H curves, makes it possible to remove nonmonotonic behavior of differential permeability around zero, improving solver performance. Additionally, it includes improved extrapolation options for the fully saturated regions.

Application Library Title:
bh_curve_checker
Download from the Application Gallery