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球栅阵列中基于能量的热疲劳预测

Application ID: 16143


本案例分析了热载荷下粘塑性焊点的疲劳可靠性。基于 Darveaux 能量模型预测了两个球栅装配之间的焊点寿命。模型基于薄层中的平均能量耗散密度计算了焊点的破坏。

This model is included as an example in the following products:

疲劳模块

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