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焊点的粘塑性蠕变

Application ID: 4488


本案例通过 Anand 粘塑性模型研究了焊点受热载荷作用时的粘塑性蠕变。

This model is included as an example in the following products:

非线性结构材料模块

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the 技术规格表 and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.