快速搜索

Boat Reactor for Low Pressure Chemical Vapor Deposition

Application ID: 249


Chemical vapor deposition (CVD) is an important step in the process of manufacturing microchips. One of the common applications is the deposition of silicon on wafers at low pressure. Low pressure reactors are used to get a high diffusivity of the gaseous species, which results in a uniform deposition thickness, since the process becomes limited by the deposition kinetics.

The goal of this simulation is to describe the rate of deposition as a function of the fluid mechanics and kinetics in such a system. In the model, the momentum and mass transport coupled to reaction kinetics for a deposition process is performed.

Silane enters the reactor and reacts on a series of wafers to form hydrogen and silicon. The remaining mixture leaves the reactor at the outlet. The deposition of silicon, on the surface of the wafers, depends on the local concentration of silane, which is determined by the operational conditions of the reactor. Transport within the wafer bank is simulated using anisotropic diffusion coefficients to nullify diffusion in the direction perpendicular to the wafers. Convection is also nullified in this domain.

本模型示例在以下产品中提供:

化学反应工程模块

建模所需的 COMSOL® 产品组合取决于多种因素,包括边界条件、材料属性、物理场接口及零件库,等等。不同模块可能具有相同的特定功能,详情可以查阅技术规格表,推荐您通过免费的试用许可证来确定满足您的建模需求的正确产品组合。如有任何疑问,欢迎咨询 COMSOL 销售和技术支持团队,我们会为您提供满意的答复。